MSC Malaysia Job Camp - Wafer Fabrication Process and Metrology (CP303)

SynopsisJob camp (JC) offerred by Multimedia Development Corporation (MDeC) is designed specifically for any Knowledge worker who wants to improve or expand their current ICT skills and knowledge. This program seeks to help knowledge workers with the support and access to courses and trainings to stay aligned with the current needs of the ICT industry.

DreamCatcher Consulting has been appointed by MDeC to offer programs in engineering tracks namely VLSI, DSP, and RF.

The general entry requirement for the program is Diploma or Bachelor Degree in Electrical and Electronics Engineering. Upon completion of the training program, participants are expected to acquire skill sets required to meet existing vacancies in the industry.

Program Highlight

• coaching from experienced academic instructors as well as engineers from industry
• substantial lab exercises to ensure participants have ample opportunities for hands-on
• use of leading Electronic Design Automation (EDA) tools for various VLSI design, verification, and analysis activities

Program Details

• Each course is 23 days in duration
• Courses are held in Kuala Lumpur and Penang
• Course fees are fully born by MDeC

Registration
Fill up the registration form and attach with:

• With certificate: a copy of final semester transcript and a copy of Diploma/Degree certificate, or
• Without certificate: a copy of final semester transcript and completion letter from college/university

Enquiries

• Phone: 04-640 7112 or
• E-mail: jc@dreamcatcher.asia

Visit http://dreamcatcher.asia/jc.htm for full details.

What You Will Learn1) necessary technical soft skills for engineers to adapt from the university environment to real life technical working environment. These skills are:

• Technical writing
• Technical presentation
• Creative problem solving - Triz

2) Pre-requisite knowledge required to start working in semiconductor industries. This knowledge includes:

• Cleanroom design, practices and safety
• Semiconductor material properties
• Understanding semiconductor devices
• Process control and improvement
• History and future of microelectronic industry
• Wafer test and yield analysis

3) Working skills required to fabricate the semiconductor devices. These skills are 

• Preparation of semiconductor substrate
• Semiconductor device processing includes FEOL and BEOL processes
• Packaging of semiconductor devices

4) Failure analysis skills required to improve the device yield and process flow. These skills are

• Metrology in semiconductor industries
• Failure mechanisms in semiconductor

Who Should AttendAvailable K-Workers who are looking for practical skills in preparation for a technical career in semiconductor industry such as:

• Process engineer
• Test engineer
• Failure analysis engineer
• Yield enhancement engineer
• Product engineer
• etc.

Prerequisite

• Malaysian graduates
• Diploma/Degree holders in ICT-related fields
• Available K-Workers (currently unemployed, in-between jobs, changing fields, retrenched)
• CGPA 2.5 or above

Course MethodologyThe participants are first taught the knowledge and preparation required to work in the semiconductor industries from the trainers with working experience in respective area. The concepts are re-enforced through tutorial and industrial related case studies.

The participants are then taught the overall fabrication process from substrate preparation to packaging. Finally, the metrology and failure mechanisms of semiconductor devices. In order to improve the understanding of whole processes, the actual industrial examples will be given during the classes.

After acquired pre-requisite knowledge, semiconductor manufacturing processes and failure analysis in the subject area, the participants are required to go for a field trip to wafer fabrication company.

Course Duration23 days, 9am - 5pm

Course StructureModule 1: Technical Soft Skills (3 days)

• Technical writing
• Technical presentation
• Creative problem solving

Module 2: The History and Future of Semiconductor Industry (1 day)

• Appreciate the history of transistor and its limitation
• Planar technology and integrated circuits
• Evolution of IC especially microprocessors
• Moore's law and ITRS
• Scaling down technology
• Advanced manufacturing technologies
• Non-conventional silicon

Module 3: Cleanroom Technologies and Practices (1 day)

• Clearoom design technology
• Classification of cleanroom
• Sources of contamination in cleanroom
• Cleanroom control and safety practices

Module4: Semiconductor Material Properties and Devices (2 days)

• Review of material physical and electrical properties
• Fundamental concepts of semiconductors
• Basic semiconductor device structures and designs
• Practical device design issues and considerations

Module 5: Semiconductor Crystal Growth and Substrate Preparation (1 day)

• Wafer requirements in International Roadmap for Semiconductor (ITRS)
• Growth of silicon crystal
• Silicon wafer preparation technology
• Limitation, issues and problems in various wafer preparation processes
• Wafer inspection tools

Module 6: Semiconductor Device Processing and Manufacturing (3 days)

• Wafer fabrication technology in various processing area
• Processing affects yield and parametric test
• Common problem associated with wafer fabrication and its impact on yield

Module 7: Fundamental of IC package technology and design (3 days)
1) Overview of IC Packaging

• Applications of IC packaging
• Packaging types & interconnect technologies
• IC package construction
• IC packaging trends
• Package selection criteria

2) Package Physical Design & Considerations

• Design dependencies
• Physical design flow
• Design rules

3) Package Electrical Design & Considerations

• Fundamental of electrical design
• Transmission line and impedance concept
• Power delivery design & analysis

4) Package Mechanical Design & Considerations

• Thermal design & power dissipation
• Mechanical design & analysis
• Reliability: reliability testing overview, typical accelerated stress, common failure mechanisms & drivers

5) Summary of IC Package Design Challenges

Module 8: Process Control and Improvement (2 days)

• Statistical process control (SPC) concepts
• Choices of SPC control charts for variable and attribute data
• Data collection schemes for SPC control charts
• Real-time process monitoring using SPC control charts
• Process stability and its various states
• Process capability and comparison to natural tolerance limit
• Actions for improving process stability and process capability

Module 9: Wafer Test and Yield Analysis (2 days)

• Semiconductor process characterization 
• In-line test methodology
• Yield models
• Process contribution to yield loss
• Defect density
• Defect statistics for predicting yield

Module 10: Metrology Technology (2 days)

• Metrology for product yield enhancement
• The metrology tool resolution, limits and failure mode
• Various microscopic techniques
• Various spectroscopic techniques
• Various electrical probe techniques

Module 11: Failure Mechanism in Semiconductor Devices (3 days)

• Reliability models for the failure mechanism
• Why failure occur
• How to detect the various failure modes
• The mechanisms underlying each failure mode
• Failure analysis tools to investigate the failure mechanisms