MSC Malaysia Job Camp - IC Packaging Design (CP308)

SynopsisJob camp (JC) offerred by Multimedia Development Corporation (MDeC) is designed specifically for any Knowledge worker who wants to improve or expand their current ICT skills and knowledge. This program seeks to help knowledge workers with the support and access to courses and trainings to stay aligned with the current needs of the ICT industry.

DreamCatcher Consulting has been appointed by MDeC to offer programs in engineering tracks namely VLSI, DSP, RF and others relevant for the ICT industry.

The general entry requirement for this program is Diploma or Bachelor Degree in Mechanical Engineering. Upon completion of the training program, participants are expected to acquire skill sets required to meet existing vacancies in the industry.

Program Highlight

• coaching from experienced academic instructors as well as engineers from industry
• substantial lab exercises to ensure participants have ample opportunities for hands-on
• use of leading Electronic Design Automation (EDA) tools for various VLSI design, verification, and analysis

Program Details

• each course is 23 days in duration
• courses are held in Kuala Lumpur and Penang
• course fees are fully born by MDeC

Registration
Fill up the registration form and attach with:

• With certificate: a copy of final semester transcript and a copy of Diploma/Degree certificate, or
• Without certificate: copy of final semester transcript and completion letter from college/university

Enquiries

• Phone: 04-640 7112 or
• Email: jc@dreamcatcher.asia

Visit http://dreamcatcher.asia/jc.htm for full details.

What You Will Learn1) Necessary technical soft skills for engineers to adapt from the university environment to real life technical working environment. These skills are:

• Technical writing
• Technical presentation
• Creative problem solving - Triz

2) Pre-requisite knowledge required to start working in semiconductor industries. This knowledge includes:

• Common types of IC packages
• Materials, properties and selection of IC packages
• PCB Technology
• IC packaging assembly
• Principles of IC packaging design
• Reliability and failure analysis of IC packages

3) Essential working skills required to assist the basic design work of IC packages. These skills are:

• Fabrication process of IC packages
• Fundamental steps for performing physical design of IC packages
• Fundamental steps for performing the electrical design of IC packages
• Fundamental steps for performing the structural design of IC packages
• Fundamental steps for performing the thermal design of IC packages
• Basic reliability test and failure analysis

Who Should AttendAvailable K-Workers who are looking for practical skills in preparation for a technical career in semiconductor industry such as

• IC packaging design engineer
• Process engineer
• Test engineer
• Failure analysis engineer
• Yield enhancement engineer
• Product engineer

Prerequisite

• Malaysian citizens
• Available K-Workers (currently unemployed, in-between jobs, changing fields, retrenched) with Diploma or Bachelor Degree in Mechanical Engineering or related discipline
• CGPA 2.5 or above

Course MethodologyThe participants are first taught the knowledge and preparation required to work in the semiconductor industries from the trainers with working experience in respective area. The concepts are re-enforced through tutorial and industrial related case studies.

The participants are then taught the fundamental knowledge of IC packages, assembly process and basic design skills for IC packages. In order to improve the understanding of whole processes, the actual industrial examples will be given during the classes.

After acquiring the pre-requisite knowledge of IC packaging technology, assembly processes, basic IC packaging design and failure analysis, the participants are required to go for a field trip to IC packaging design company.

Course Duration23 days, 9am - 5pm

Course StructureModule 1 : Technical Soft Skills (3 days)

• Technical writing
• Technical presentation
• Creative problem solving

Module 2 : Overview of IC Packaging (3 days)

• Overview of IC Packaging Technology
• Common IC packages and selection criteria
• Fundamentals of IC packaging design
• Principles of IC packaging assembly

Module 3 : Overview of PCB Technology (2 days)

• Overview of PCB Assembly
• PCB raw material & selection
• PCB and Assembly Issues and Solutions

Module 4 : Fundamental of IC Packaging Assembly (1 day)

• Introduction to IC package assembly process
• Front of line assembly process
• End of line assembly process
• Test and back end process
• Challenges in IC packaging assembly

Module 5 : Physical Design of IC Packaging (5 days)

• APD Design Tool
• Design database
• Symbol Library
• Netlist & Net Assign
• Route and Editing
• Power Plane
• Manufacturing collaterals generation

Module 6 : Electrical Design of IC Packaging (2 days)

• Introduction to IC package electrical design
• Introduction to Power delivery design
• Connector selection
• Shielding
• Grounding
• Bonding

Module 7 : Structural and Thermal Design and Analysis of IC Packaging (7 days)

• Fundamentals of structural design
• Fundamentals of thermal design
• Stress analysis and finite Element Analysis
• Practical thermal analysis

Module 8 : Basic Packaging Reliability & Failure Analysis (1 day)

• Introduction to IC package reliability
• Basic failure analysis in IC package
• common failure mechanism
• Reliability testing
• Moisture sensitivity level (MSL)