MMAM TeSSDE - E&E Wafer Fabrication (CP336)

SynopsisTechnology Specialist in Specific Domain Expertise (TeSSDE) program offerred by MIGHT-METEOR Advanced Manufacturing (MMAM) is designed to prepare new graduate engineers for working in specific high technology and high impact industries. Working closely with industrial partners this program seeks to accelerate the learning of engineers with the access to industrial-relevant trainings and support in order for them to stay aligned with the current development of human capital in these industries.

DreamCatcher Consulting has been appointed by MMAM to offer programs in engineering tracks namely Wafer Fabrication, Solid State Lighting (SSL), and Oil and Gas (Offshore and Subsea).

The general entry requirement for this program is a Bachelor's Degree in Electrical and Electronic Engineering, Microelectronic Engineering, Manufacturing Engineering, Applied Sciences, Power Engineering or other similar disciplines. Upon completion of the training program, participants are expected to acquire skill sets required to meet existing vacancies in the industry.

Program Highlight

• Coaching from professional trainers and engineers from industry as well as experienced academic instructors
• Substantial tutorials, assignments and projects to ensure participants have ample opportunities for hands-on and direct appreciation of subject areas

Program Details

• Each course is 80 days in duration
• Courses are held in Penang
• Course fees are fully born by MMAM

Registration

Fill up the registration form and attach with:

• With certificate: a copy of final semester transcript and a copy of Degree certificate, or
• Without certificate: copy of final semester transcript and completion letter from university

Enquiries

• Phone: 04-640 7112 or
• Email: tessde@dreamcatcher.asia

Visit http://dreamcatcher.asia/tessde for full details.

What You Will Learn1) Necessary technical soft skills for engineers to adapt from the university environment to real life technical working environment. These skills are:

• Technical writing
• Technical presentation
• Project Management 101
• Time Management
• Creative problem solving - Triz

2) To equip participants with pre-requisite knowledge required to start working in wafer fabrication industry. This knowledge includes:

• Clean room technologies and practices
• Semiconductor materials and devices
• Wafer fabrication preparation
• Semiconductor device processing and manufacturing

3) To equip participants with working skills in the design and engineering of IC packaging. These skills are:

• Types and characteristics of IC packaging
• Physical, electrical and mechanical design of IC packaging and their challenges
• IC packaging reliability and failure analysis

4) To equip participants with practical skills of the wafer fabrication industry through industrial attachment arrangement

Who Should AttendAvailable graduate engineers who are looking for practical skills in preparation for a technical career in wafer fabrication such as 

• Process Integration Engineer
• Customer Engineer
• Development Engineer
• Test Engineer
• Device Modeling Engineer
• FA Engineer

Prerequisite

• Malaysian citizens
• Available graduate engineers with a Bachelor's Degree in Electrical and Electronic Engineering, Microelectronic Engineering, Manufacturing Engineering, Applied Sciences, Power Engineering or related discipline
• CGPA 2.75 or above

Course MethodologyThe participants are first taught soft skills to enhance their personal aptitude and leadership quality for working as technical personnel in the wafer fabrication industry. They will then receive training from trainers with working experience in respective areas of wafer fabrication.

The participants are taught the fundamentals of semiconductor materials and clean room technologies and practices which are essential for working in wafer fabrication. They are then given an overview of wafer fabrication technology and manufacturing processes. The course will also cover the technology, engineering and design of IC packaging.

Industrial case studies are used in the training courses in order to re-enforced the concepts presented to the participants. Tutorials, workshops, individual and group projects are intertwined with formal lectures in order to increase the effectiveness of the learning. The participants are also required to go for field trips and visits to wafer fabrication design and manufacturing companies so they have a better understanding and appreciation of the wafer fabrication value chain and operations.

After acquired the pre-requisite and working knowledge in the subject area, the participants are required to go for 8 months of industrial attachment with the host companies.

Course Duration80 days, 9am - 5pm

Course StructureModule 1 : Technical Soft Skills

• Technical writing
• Technical presentation
• Leadership and ethics in an engineering environment
• Project management 101
• Effective time management
• Creative problem solving - Triz

Module 2: Fundamentals of Electrical & Electronics Industry

• The history and future of semiconductor industry
• Clean room technologies and practices
• Semiconductor material properties and devices

Module 3: Overview of Wafer Fabrication

• Semiconductor crystal growth and substrate preparation
• Semiconductor device processing and manufacturing

Module 4: Fundamentals of IC Packaging Technology and Design

• Overview of IC packaging
• Package physical design and considerations
• Package electrical design and considerations
• Package mechanical design & considerations
• IC package design challenges
• Basic packaging reliability and failure analysis

Module 5: Process Control

• Process control and improvement
• Quality management

Field Trips/Company Visits

Field trips and team activities pertinent to the personal and technical development of the participants will be organised during the course of this training program