Semiconductor Crystal Growth and Substrate Preparation (SE104-95-0)

SynopsisSemiconductor devices and circuits are fabricated through many mechanical, chemical, physical and thermal processes. The preparation of silicon single-crystal substrates with mechanically and chemically polished surfaces is the first step in the long and complex device fabrication processing. Silicon is the second most abundant element on earth; more than 90% of the earth's crust is composed of silica and silicate. With a boundless supply of the raw material, the problem is to transform and purity silica and silicate into the pure silicon, which is in usable state required by the semiconductor device fabrication industries.

Through this course, participants will learn the growing of silicon crystal, shaping of silicon wafer, chemical mechanical wafer polishing (CMP), mirror-like surface polishing technology, cleaning technology and finally the quality inspection of silicon wafers.

The general understanding of silicon wafer preparation technology allows the participants to understand better the silico wafers as the substrate materials for device fabrication. It is an essential element in the improvement of device reliability, cycle time, productivity and its quality determination in device fabrication and packaging industries.

The preparation of silicon wafers as the substrate material to produce semiconductor devices and circuits involves many different processes. The silicon wafer preparation begins from the purification of metallurgical grade silicon (MGS) into electronic grade silicon (EGS). The silicon ingot is grown from the melted EGS using Czochralski (Cz) method. The subsequent processes trim the ingot into a specific diameter. The trimmed silicon ingot is then sliced using the inner diameter (ID) or wire saw to produce silicon wafers. Since the slicing process is mainly mechanical process, the damage on silicon wafer surface has to be removed through various processes such as lapping, etching and polishing. Finally, the mirror-like silicon wafer is then cleaned by RCA cleaning process. The surface quality will be inspected by inspection tools before shipment to the customers.

This course will look at various processes in silicon wafer preparation. It will also include the possible limitation and contamination within the processes, which may affect the quality of silicon wafers as substrate materials for device fabrication.

What previous participants say about this course
Answers to the question 'what did you like most about the course'

• “Industry samples/application that provided by Dr. Lee” - 20 Oct 08
• “It cover real practica/industrial knowledge. Instructor is also equip with real industry background” - 20 Oct 08
• “Learn something never explore before” - 20 Oct 08
• “Silicon wafer preparation” - 20 Oct 08
• "Lecturer is like a moving book" - 1 Jun 10
• "The growth and the process of silicon wafer" - 1 Jun 10
• "Silicon growth process" - 1 Jun 10
• "The way the instructor presents in the class" - 1 Jun 10

What You Will Learn

• Wafer requirements in ITRS
• Growth of silicon crystal
• Silicon wafer preparation technology
• Limitation, issues and problems in various processes
• Wafer inspection tools

Who Should Attend

• Process engineers
• IQC, QA, QC engineers
• Product engineers
• Production Supervisor and Technician

PrerequisiteTechnical background with working experience in semiconductor devices and ICs.

Course MethodologyThis course is presented classroom style, with case studies to illustrate the concepts taught.

Course Duration1 day, 9am to 5pm

Course Structure

1. Wafer requirements in ITRS
2. Overview of silicon wafer preparation processes
3. The growth of silicon ingot
4. Shaping of silicon ingot
5. Ingot mounting and slicing
6. Silicon wafer edge grinding and lapping
7. Etching and polishing of silicon wafer
8. Silicon wafer final cleaning 9. Silicon wafer quality inspection