Design and Analysis of Burn-in for Semiconductor Devices (SE85-31-0)

SynopsisAn inherent characteristic in semiconductor devices that exhibit a higher failure rate in their early operating life has been long recognized. Appropriate effort/test must be put in place during production to prevent premature failures of devices in the field. Burn-in has been widely used to address this issue. However, through process improvement and better understanding of process technologies, the requirement for burn-in in mature devices and processes has been reduced significantly. Nevertheless, for newly-introduced process technologies and products, the time to market pressure has prompted manufacturers to resort to using burn-in as a viable approach to move new products out to the market quickly, whilst awaiting effort to acquire more knowledge to eliminate or reduce burn-in to meet a specific targeted annual field return rate.

The course will look at the various aspects of burn-in, with particular focus on the design of burn-in with respect to the burn-in condition and duration determination, effectiveness study and cost analysis.

What previous participants say about this course
Answers to the question 'what did you like most about the course'

• "It covers most of the aspects of Burn-in of Semiconductor" - 13 Nov 06
• "Burn-in purpose, select B2 time & cost" - 13 Nov 06
• "Example provided and knowledge sharing" - 13 Nov 06
• "knowlegable and experience instructor" - 13 Nov 06
• "The concept of burn in & how to determine the time for burn in." - 25 Sept 08
• "Gave an overall introduction to the process of burn in. Provided real life examples on how to apply the text book theories to the problems seen in work." - 25 Sept 08

What You Will Learn

• The nature of burn-in
• The various aspect in determining burn-in time
• The method to shorten burn-in time
• Burn-in data analysis
• Various documents for burn-in

Who Should Attend

• Process engineers
• QA engineers
• Product engineers

PrerequisiteTechnical background with working experience in semiconductor devices and ICs.

Course MethodologyThis course is presented classroom style, with case studies to illustrate the concepts taught.

Course Duration2 days, 9am - 5pm

Course Structure1) Introduction

• Why burn-in is needed
• How does burn-in work
• The basic time-to-failure pattern of components
• Burn-in definitions, difference between burn-in and environmental stress screening

2) Burn-in methods and document

• Various type of burn-in methods
• static burn-in
• dynamic burn-in
• sequential burn-in
• multilayer burn-in
• Barlow's method
• Markovian Burn-in
• Mil-Std and Mil-HDBK relating to burn-in

3) Analysis of burn-in test data

• Analyze the burn-in test data using reliability model and mixture distributions methodology to extract distribution parameters
• The application of these data for burn-in decision

4) Burn-in time determination

• Various methods of determining the burn-in time to meet different objectives, namely
• To achieve a specified failure rate
• To achieve a specified reliability goals
• To achieve a minimum cost and burn-in efficiency
• Graphical and analytical analysis methods for burn-in time determination
• The concept ofmean residual life for burn-in time determination

5) Accelerated burn-in

• Burn-in time reduction algorithm using accelerated environment conditions such as temperature, voltages and temperature cycling etc.

6) Planning and controlling production burn-in

• Bringing together the knowledge learnt in previous sections and providing a typical systematic "cook-book" approach to the planning of burn-in procedure for semiconductor devices. This includes burn-in planning during the product design phase and the pre-production phase, the execution and control of production burn-in.